Semiconductor components are an indispensable part of electronic devices such as computers, mobile phones, etc. Semiconductor manufacturing is the process of systematically producing semiconductor parts while controlling costs and ensuring strict control standards. For businesses in the electronics sector - where strict standards and large output volumes are required - a specialized semiconductor manufacturing department is undeniably important. This is leading to an increase in demand for personnel with cross-industry skills in the areas of chip designing, manufacturing, and packaging.
Ensuring the efficient production of semiconductor devices and components is the purpose of semiconductor manufacturing. Here are the main goals:
1. Quality specs: To ensure that semiconductors perform consistently and dependably, they fulfill strict quality requirements.
2. Efficient Supply Chain: Establishing an effective supply chain to source the supplies, parts, and machinery required to produce semiconductors.
3. Cost Optimization: Reducing the expenses in manufacturing while maintaining product quality.
4. Productivity Management: Control and optimize productivity.
5. Technology Development: Update and apply advancements in technology to improve semiconductor manufacturing capabilities and processes.
6. Process Characterization: Characterizing manufacturing processes to understand and control variations, ensuring consistent output.
7. Environmental factors: Includes environmentally friendly and sustainable processes in semiconductor manufacturing.
8. Level of Market Competitiveness: Creating semiconductor products that stay ahead of trends and promptly respond to market needs can help you maintain competitiveness in the market.
Along its value chain, the semiconductor industry is a complex ecosystem with a variety of jobs and responsibilities. Every step of the process, from an integrated circuit (IC) design upstream to midstream manufacture, testing, and packaging downstream, calls for specific knowledge. The top five positions in each sector are summarized here, reflecting the dynamic recruitment landscape within this field:
1. Digital IC Design Engineer
Designing digital architectures and circuits, specializing in SOC, MCU, and FPGA design. It is essential to be proficient with HDL software such as Verilog and VHDL.
2. Analog IC Design Engineer
Specializes in Cadence/Synopsys tools and BCD process technology to design analog and mixed-signal circuits for a range of applications.
3. Software Design Engineer
Creating middleware, embedded operating systems, and low-level device drivers. Particularly for AI/ML applications, expertise with embedded Linux, RTOS kernels, and C/C++ is highly valued.
4. Firmware Design Engineer
Developing low-level firmware for MCUs and SOCs, including interfacing with hardware peripherals and embedded security features. C/C++ proficiency is required.
5. Electronics Engineer
Supporting IC design teams through circuit simulations, device modeling, and EDA tool proficiency. It is required to have some background in digital/analog circuits and semiconductor device physics.
1. Semiconductor Engineer
Interfacing with foundries on technology development, process characterization, and yield management. Expertise in CMOS logic/memory processes, lithography, deposition, and etch is required.
2. Firmware Design Engineer
Developing firmware for tool interfacing, data collection, and recipe scheduling. It is preferred to know C/C++, semiconductor equipment protocols, and PLC/SCADA systems.
3. Operator/Packager
Operating tools for lithography, deposition, etching, and die packaging. International safety and quality certifications are added advantages.
4. Software Design Engineer
Programming software for fault detection, SPC, and predictive maintenance. Proficiency with Python, C++, SQL databases, and semiconductor data analytics is important.
5. Semiconductor Equipment Engineer
Commissioning, maintaining, and troubleshooting etchers, diffusion furnaces, and bonders. Experience installing and qualifying tools from vendors like Applied Materials and Lam Research is valued.
1. Operator/Packager
Assembling, inspecting, and testing packaged ICs using automated and semi-automated equipment lines. It is necessary to have prior expertise with lead frame insertion, die/wire bonding, and encapsulation.
2. Firmware Design Engineer
Developing low-level software for handlers, testers, and burn-in boards. Experience with ATE instrumentation software and verification test suites is preferred.
3. Software Design Engineer
Programming test program sets, binning algorithms, and data analytics dashboards to monitor assembly line performance. Background in Java, C++, and SQL databases is valued.
4. Domestic Sales Representative
Liaising with domestic clients from various sectors. Proficiency in business development and account management is essential.
5. Production Technology/Process Engineer
Leading yield enhancement initiatives, driving technology transfers, and sustaining production processes. This position requires manufacturing and semiconductor equipment experience.